Introduction to EMI/EMC Design for Printed Circuit Boards Using Signal Integrity Tools for EMC Analysis Shielding in Enclosures with Apertures What To Do If a Product Fails in the EMC LabThere is a newer edition of this item. Printed Circuits Handbook, Seventh Edition Clyde F. Coombs, Jr. The printed circuit is the basic building block of the electronics hardware industry. It connects virtually all the components used, and affects every employee associated with the product, including design, fabrication, assembly, sourcing, quality, and reliability. There are still very few readily available courses that deal with printed circuits, and, therefore, this handbook remains a major source of information on the subject. Written by a global team of experts from both industry and academia, this new edition of the handbook will deal with both the increasing pressures of High Density Interconnect and the huge government-mandated changes related to lead-free manufacturing.
Title: Printed Circuits Handbook, Sixth EditionPublisher: : New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, TorontoCopyright / Pub. Date: 2008 The McGraw-Hill CompaniesISBN: 9780071467346Authors:Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.Description:Written by a global team of experts from both industry and academia, this new edition of the handbook will deal with both the increasing pressures of High Density Interconnect and the huge government-mandated changes related to lead-free manufacturing. Chapter 2: The Electrical Engineering Problem Chapter 3: Major Elements in an Electronic System Chapter 4: Assumptions Often Made About Electronic Systems Chapter 5: How Real Systems and Their Components Are Far From Ideal
Chapter 6: Transmission Lines Chapter 7: What’s Moving on a Transmission Line? Chapter 8: Basics of Electromagnetic Fields Chapter 9: Digital vs. Rf/Microwave vs. Analog Chapter 10: Time and Distance Chapter 14: Fundamentals of Transmission Lines Chapter 15: The Concept of Ground and Power Planes Chapter 17: Reflections – What Causes Them and What They Do to a Signal Chapter 18: What is Meant by Signal Integrity Engineering Chapter 19: When is a Design High-Speed? Chapter 20: Controlling Reflections By Using Terminations Chapter 21: Terminator Type, Terminator Placement and Net Sequencing Chapter 22: Stubs on Transmission Lines? Chapter 23: Properties of Transmission Lines That Affect Impedance Chapter 24: Methods For Calculating and Measuring Impedance Chapter 25: Right-Angle Bends and Vias: Potential Sources of Reflections and Other Problems Chapter 26: Types of Drivers or Sources Chapter 27: Types of Loads
Chapter 28: Bus Protocols Chapter 29: Crosstalk or Coupling? Chapter 30: Single-Ended Signaling Chapter 31: Differential Signaling Chapter 32: The Power Subsystem Chapter 33: Power Distribution DC Drop Chapter 34: Decoupling Capacitors Chapter 35: Power Subsystem Inductance Chapter 36: Power Dissipation Estimate Chapter 37: Example Power Subsystem Design Chapter 38: IC Packages – Vcc and Ground Bounce or SSN Chapter 39: Noise Margins Chapter 40: Design Rule Creation Using Noise Margin Analysis Chapter 41: The PCB Fabrication Process Chapter 42: PCB Materials Chapter 43: Creating PCB Stackups Chapter 44: Types of Vias Chapter 45: PCB Design Process Chapter 46: PCB Routing Chapter 48: The Ideal Component Data SheetOur specialty is in the complex, advanced technology of PCB fabrication and assembly, producing high quality multi-layered PCBs from elaborate layouts. With us, you receive unparalleled technical expertise at competitive prices as well as the most progressive solutions available.
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