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On April 2, according to foreign media reports, the Moscow Institute of Electronic Technology (miet) of Russia has received 670 million rubles (about 51 million yuan) from the Ministry of trade and industry to prepare for the research and development of a lithography machine for manufacturing chips. It is claimed that the process of this lithography machine can reach the EUV level, but the technical principle is completely different. They have developed a maskless X-ray lithography machine based on synchrotron and/or plasma source.
According to the article,”miet has made progress in the field of maskless EUV lithography, including joint research with other domestic scientific research institutions and scientist groups. The project will also involve Zelenograd’s ESTO and Zelenograd synchrotron, which is now Zelenograd of the technology storage complex (TNK) of the Kurchatov Institute of the National Research Center.
“Based on the synchrotron operated and launched in the country, especially the synchrotron of tnkzelenograd and domestic plasma source, the creation of technology and equipment will make it possible to process semiconductor chips with design standards of 28nm, 16nm and below,” the bidding document includes the requirements of this research work (R & D).”There are no maskless X-ray lithography and similar devices in the world.”
It is understood that because the wavelength of X-ray is very short and there is almost no diffraction effect, X-ray lithography entered the field of vision of lithography technology research and development very early, and X-ray lithography appeared in the 1980s. In the 1990s, IBM built a high-frequency IC production line with synchrotron radiation light source X-ray lithography as the main force in Vermont, with the U.S. military as the main customer. At that time, X-ray lithography technology was a strong competitor of the next generation lithography technology at that time. Later, with the maturity of excimer laser and GAF lens technology, deep UV lithography continued, beating X-ray lithography in resolution and economy. X-ray lithography has withdrawn from the competition of mainstream lithography technology.
At present, LIGA technology is mainly used in X-ray lithography. It is a technology used to manufacture high aspect ratio structure. It can produce 100:1 aspect ratio and be applied to MEMS technology. At present, there are two places in China that can do X-ray lithography, one is Hefei synchrotron radiation and the other is Beijing Synchrotron radiation.
Because the X-ray collimation is very good, the traditional X-ray lithography is copied 1:1. The mask uses a silicon beam supported low stress silicon nitride film with a layer of patterned gold as a masking layer. The exposure mode adopts scanning mode, which is inefficient.
At present, the most advanced optical lithography is EUV, extreme ultraviolet lithography. We also call it soft X-ray lithography, which has the characteristics of both optical lithography and X-ray lithography. Extreme ultraviolet wavelength is very short, and no lens can enlarge or shrink, so concave mirror can only be used for reflective scaling. The mask is also reflective, the exposure mode is also scanning, and the whole system operates in vacuum.
According to public information,”miet”, which has undertaken the R & D plan of lithography machine, is a leading technical university in Russia’s high-tech field. By integrating modern laboratories, a new understanding of the educational process, and the unique integration of education, science and industry, miet has become a leader in training experts in the fields of microelectronics and Nano Electronics, telecommunications and information technology. The university is one of the three most powerful universities in the ranking of Russian University invention activities, one of the top five technical universities in the ranking of Moscow State University, and one of the top 20 Russian Universities in the famous British publication the times.
In fact, Russia has already been sanctioned by the United States in the chip manufacturing industry. The only semiconductor enterprise in Russia Ангстрем The company originally planned to purchase necessary process equipment through AMD, but this transaction was due to Ангстрем The company was suspended because it was on the sanctions list of the U.S. Department of Commerce. Its factory in Zelenograd was unable to obtain enough orders due to backward process technology. It was in a state of loss for a long time, and its debt exceeded 100 billion rubles. In 2019, its largest creditor, veb RF (Russian National Development Group) carried out bankruptcy reorganization. Of course, Russia is another chip manufacturer Микрон A blessing in disguise has been used Ангстрем The opportunity for the workshop to transform the new production line of the 28nm process saved it $1 billion.
Russia’s domestic semiconductor consumer market accounts for less than 2%of the world. Without the promotion of the government, it is economically unreasonable to develop and manufacture DUV EUV lithography machines with a cost of tens of billions of dollars according to the industrial demand of such a small market (the industrial market in the world is so large). On the other hand, the Russian military and aerospace markets have little demand for chips, but there are many kinds, which requires economically reasonable production capacity of small batches and multiple varieties. The projection lithography machine suitable for mass production can not meet the needs of this industry.
Russia has two production lines using 8-inch wafers, which belong to АО « Микрон » and ООО « НМ-ТЕХ » 。 Four production lines of 6-inch wafers belong to АО « Микрон »， АО « Ангстрем »， АО « ВЗПП-Микрон » and НИИСИ РАН， The first three belong to the technical level from the 1990s to the beginning of this century. It is worth noting that the last one uses the new maskless direct writing.
In 2014, mapper company of the Netherlands and rusno company of Russia jointly established a factory in Moscow to produce MEMS optical elements, the core components of maskless lithography machine. The electro-optical components produced by the factory can divide an electron beam into 13000 electron beams and control each electron beam, which greatly improves the production efficiency of the maskless electron beam lithography machine and makes this kind of lithography machine more suitable for small batch production in addition to sample manufacturing in the design stage. Mapper’s multi beam maskless lithography machine can be used to make 32 nm, and its core component is made in Russia.
Earlier, rusnano invested in Vadim The nano locator developed by Professor lakowski’s team can be used to process aspheric optical elements with a precision of 10 nm (for ultraviolet and X-band). And this wadim Rakhovsky, it’s a big cow. In 1992, he founded a small company with his colleagues who worked in the Institute of Metrology science of the whole Union in the Soviet era to take some scattered orders for parts for electronic products in the Soviet era. In the production process, they are repeatedly tossed by mask defects. As the manufacturing process shrinks, new problems will appear, and the previously proposed solutions are no longer effective. The investment required is also higher and higher. The mask cost alone has increased from $400 in the 0.5 micron era to more than $700000 today.
At this time, rahovski thought that if the holographic image generation method is used, the impact of mask defects on product quality can be avoided. It is estimated that even if the defects occupy 1%of the holographic mask area, the actual image quality will not be affected. The influence of mask local defects on imaging quality is reduced by 9-10 orders of magnitude. This can also prolong the service life of the mask and reduce the lens cost (only a simple lens is needed to illuminate the mask), and even 3D lithography can be realized by using this technology. However, when calculating the holographic mask based on the holographic image, they encountered mathematical problems. Therefore, he found Professor Vladimir andreyevich borovikov, the founder of modern asymptotic diffraction theory, who provided him with the calculation method. However, the amount of calculation of holographic mask still needs supercomputer to complete. Later, his development team worked to simplify the algorithm until it can be implemented on a microcomputer. At the same time, they developed a software package to generate a holographic mask (in the process, they found that if the hologram is reproduced with plane wave, the topology of the mask will become impossible to manufacture. Therefore, they solved the problem of converging spherical wave through mathematical method).
At first, he found rusnano and hoped to invest in its holographic projection lithography technology. But rusno’s attitude disappointed him. Later, the elder brother found the president of semi Europe, so he received financial support from EMPA, Switzerland, and established nanotech SWHL GmbH in 2015. According to the Daniel’s point of view, the leaders of the Russian government are familiar with large industries, but not technology intensive industries, and lack the foresight of the Soviet government in incubating and investing in advanced technologies with industrial potential.
The maskless X-ray lithography machine reported by foreign media this time can not meet the demand of mass production. However, from 2020 to September 2021, only 266 billion rubles will be allocated to Russia’s entire electronic industry. At least trillions of rubles will be invested in a 28 nm production line and supporting wafer factory. With such a large investment, it is difficult for Russia’s domestic market to provide enough orders to maintain its operation. Lithography machine and chip manufacturing have never been the same way since ancient times. There are different technical paths to solve different needs (for example, embossing method is also a promising process in mass production).

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Previous Post Previous post: Nature Communications:a new breakthrough in mid infrared single photon imaging
Next Post Next post: Latest statistics! List of national laboratories for biological seed industry
provides chemical analysis, laboratory equipment, life science, environmental monitoring, physical testing and other instruments guide and industrial research, online training, recruitment, instrument forum and other one-stop services.
On April 2, according to foreign media reports, the Moscow Institute of Electronic Technology (miet) of Russia has received 670 million rubles (about 51 million yuan) from the Ministry of trade and industry to prepare for the research and development of a lithography machine for manufacturing chips. It is claimed that the process of this lithography machine can reach the EUV level, but the technical principle is completely different. They have developed a maskless X-ray lithography machine based on synchrotron and/or plasma source.
According to the article,”miet has made progress in the field of maskless EUV lithography, including joint research with other domestic scientific research institutions and scientist groups. The project will also involve Zelenograd’s ESTO and Zelenograd synchrotron, which is now Zelenograd of the technology storage complex (TNK) of the Kurchatov Institute of the National Research Center.
“Based on the synchrotron operated and launched in the country, especially the synchrotron of tnkzelenograd and domestic plasma source, the creation of technology and equipment will make it possible to process semiconductor chips with design standards of 28nm, 16nm and below,” the bidding document includes the requirements of this research work (R & D).”There are no maskless X-ray lithography and similar devices in the world.”
It is understood that because the wavelength of X-ray is very short and there is almost no diffraction effect, X-ray lithography entered the field of vision of lithography technology research and development very early, and X-ray lithography appeared in the 1980s. In the 1990s, IBM built a high-frequency IC production line with synchrotron radiation light source X-ray lithography as the main force in Vermont, with the U.S. military as the main customer. At that time, X-ray lithography technology was a strong competitor of the next generation lithography technology at that time. Later, with the maturity of excimer laser and GAF lens technology, deep UV lithography continued, beating X-ray lithography in resolution and economy. X-ray lithography has withdrawn from the competition of mainstream lithography technology.
At present, LIGA technology is mainly used in X-ray lithography. It is a technology used to manufacture high aspect ratio structure. It can produce 100:1 aspect ratio and be applied to MEMS technology. At present, there are two places in China that can do X-ray lithography, one is Hefei synchrotron radiation and the other is Beijing Synchrotron radiation.
Because the X-ray collimation is very good, the traditional X-ray lithography is copied 1:1. The mask uses a silicon beam supported low stress silicon nitride film with a layer of patterned gold as a masking layer. The exposure mode adopts scanning mode, which is inefficient.
At present, the most advanced optical lithography is EUV, extreme ultraviolet lithography. We also call it soft X-ray lithography, which has the characteristics of both optical lithography and X-ray lithography. Extreme ultraviolet wavelength is very short, and no lens can enlarge or shrink, so concave mirror can only be used for reflective scaling. The mask is also reflective, the exposure mode is also scanning, and the whole system operates in vacuum.
According to public information,”miet”, which has undertaken the R & D plan of lithography machine, is a leading technical university in Russia’s high-tech field. By integrating modern laboratories, a new understanding of the educational process, and the unique integration of education, science and industry, miet has become a leader in training experts in the fields of microelectronics and Nano Electronics, telecommunications and information technology. The university is one of the three most powerful universities in the ranking of Russian University invention activities, one of the top five technical universities in the ranking of Moscow State University, and one of the top 20 Russian Universities in the famous British publication the times.
In fact, Russia has already been sanctioned by the United States in the chip manufacturing industry. The only semiconductor enterprise in Russia Ангстрем The company originally planned to purchase necessary process equipment through AMD, but this transaction was due to Ангстрем The company was suspended because it was on the sanctions list of the U.S. Department of Commerce. Its factory in Zelenograd was unable to obtain enough orders due to backward process technology. It was in a state of loss for a long time, and its debt exceeded 100 billion rubles. In 2019, its largest creditor, veb RF (Russian National Development Group) carried out bankruptcy reorganization. Of course, Russia is another chip manufacturer Микрон A blessing in disguise has been used Ангстрем The opportunity for the workshop to transform the new production line of the 28nm process saved it $1 billion.
Russia’s domestic semiconductor consumer market accounts for less than 2%of the world. Without the promotion of the government, it is economically unreasonable to develop and manufacture DUV EUV lithography machines with a cost of tens of billions of dollars according to the industrial demand of such a small market (the industrial market in the world is so large). On the other hand, the Russian military and aerospace markets have little demand for chips, but there are many kinds, which requires economically reasonable production capacity of small batches and multiple varieties. The projection lithography machine suitable for mass production can not meet the needs of this industry.
Russia has two production lines using 8-inch wafers, which belong to АО « Микрон » and ООО « НМ-ТЕХ » 。 Four production lines of 6-inch wafers belong to АО « Микрон »， АО « Ангстрем »， АО « ВЗПП-Микрон » and НИИСИ РАН， The first three belong to the technical level from the 1990s to the beginning of this century. It is worth noting that the last one uses the new maskless direct writing.
In 2014, mapper company of the Netherlands and rusno company of Russia jointly established a factory in Moscow to produce MEMS optical elements, the core components of maskless lithography machine. The electro-optical components produced by the factory can divide an electron beam into 13000 electron beams and control each electron beam, which greatly improves the production efficiency of the maskless electron beam lithography machine and makes this kind of lithography machine more suitable for small batch production in addition to sample manufacturing in the design stage. Mapper’s multi beam maskless lithography machine can be used to make 32 nm, and its core component is made in Russia.
Earlier, rusnano invested in Vadim The nano locator developed by Professor lakowski’s team can be used to process aspheric optical elements with a precision of 10 nm (for ultraviolet and X-band). And this wadim Rakhovsky, it’s a big cow. In 1992, he founded a small company with his colleagues who worked in the Institute of Metrology science of the whole Union in the Soviet era to take some scattered orders for parts for electronic products in the Soviet era. In the production process, they are repeatedly tossed by mask defects. As the manufacturing process shrinks, new problems will appear, and the previously proposed solutions are no longer effective. The investment required is also higher and higher. The mask cost alone has increased from $400 in the 0.5 micron era to more than $700000 today.
At this time, rahovski thought that if the holographic image generation method is used, the impact of mask defects on product quality can be avoided. It is estimated that even if the defects occupy 1%of the holographic mask area, the actual image quality will not be affected. The influence of mask local defects on imaging quality is reduced by 9-10 orders of magnitude. This can also prolong the service life of the mask and reduce the lens cost (only a simple lens is needed to illuminate the mask), and even 3D lithography can be realized by using this technology. However, when calculating the holographic mask based on the holographic image, they encountered mathematical problems. Therefore, he found Professor Vladimir andreyevich borovikov, the founder of modern asymptotic diffraction theory, who provided him with the calculation method. However, the amount of calculation of holographic mask still needs supercomputer to complete. Later, his development team worked to simplify the algorithm until it can be implemented on a microcomputer. At the same time, they developed a software package to generate a holographic mask (in the process, they found that if the hologram is reproduced with plane wave, the topology of the mask will become impossible to manufacture. Therefore, they solved the problem of converging spherical wave through m
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